Hirsch Metals supplies a wide variety of solder pastes for electronics SMT applications.Solder pastes are available in RMA, No-Clean Contact and Water-Soluble Contact.
Hirsch Metals RMA-223AS is a cream conforming to ANSI/J-STD-004-006. It is specifically designed for today’s SMT applications. It is a homogeneous mixture of the highest quality pre-alloyed solder powders and mildly activated resin paste flux. With a special blend of gelling additives in this formulation, it prevents segregation of solder cream and provides a creamy mixture ready for application. The residue from RMA-223AS is light amber and clear of solder balls. This specification covers the solder paste RMA-223-AS; 89.5-90.5% for stencil printing and 87% for dispensing in interconnection of surface mount devices.
No-Clean Contact Paste
The No-Clean series of solder pastes replaces RMA and Water-Soluble types and eliminates any form of post-soldering cleaning. This paste has a wider process window and better compatibility with OSPs than previous versions. It also provides long print life in continuous printing operations.With a highly successful and innovative polymer-dendrimer activator system.
Water-Soluble Contact Paste
The Hirsch Metals Water-Soluble Contact Paste series is a new class of water-washable formulations. Scientists at Hirsch Metals have developed a water-soluble version of the innovative polymer-dendrimer activator system used in the highly successful No-Clean formulation series. This activator system, coupled with a highly stable and clean rinsing binder, provides the excellent activity, working life and cleaning needed for today’s demanding applications.This specification covers the Water-Soluble Contact paste; 89.5% for stencil printing and 87% for dispensing in interconnection of surface mount devices.
The Contact series of pastes, utilizing the polymer-dendrimer activator system, offer an extremely wide process window (basically a drop-in series), are extremely wettable, produce very shiny joints, have extended tack times before or after placing of components, and produce a polymer coating to the solder joints after reflow. These pastes are very competitively priced.
Our solder pastes have consistent properties for excellent process control, low levels of oxides to ensure excellent wetting and flow and are specifically designed for today’s tight packaging.
Download the MSDS and Technical Data Sheets for profiles, alloys and other specifications.
Hirsch Metals Pastes
Hirsch Metals also carries a complete line of Hirsch Metals pastes including Synthetic, Synthetic-LF Lead-Free, NC-559, N-560 and LF-4300. All Hirsch Metals solder pastes conform to ANSI/J-STD-006 and are available for immediate delivery in jars, cartridges, syringes and ProFlow Cassettes.