Solder Paste

Solder Paste

Hirsch Metals supplies a wide variety of solder pastes for electronics SMT applications.Solder pastes are available in RMA, No-Clean Contact and Water-Soluble Contact.

RMA-223AS

Hirsch Metals RMA-223AS is a cream conforming to ANSI/J-STD-004-006. It is specifically designed for today’s SMT applications. It is a homogeneous mixture of the highest quality pre-alloyed solder powders and mildly activated resin paste flux. With a special blend of gelling additives in this formulation, it prevents segregation of solder cream and provides a creamy mixture ready for application. The residue from RMA-223AS is light amber and clear of solder balls. This specification covers the solder paste RMA-223-AS; 89.5-90.5% for stencil printing and 87% for dispensing in interconnection of surface mount devices.

No-Clean Contact Paste

The No-Clean series of solder pastes replaces RMA and Water-Soluble types and eliminates any form of post-soldering cleaning. This paste has a wider process window and better compatibility with OSPs than previous versions. It also provides long print life in continuous printing operations.With a highly successful and innovative polymer-dendrimer activator system.


Water-Soluble Contact Paste

The Hirsch Metals Water-Soluble Contact Paste series is a new class of water-washable formulations. Scientists at Hirsch Metals have developed a water-soluble version of the innovative polymer-dendrimer activator system used in the highly successful No-Clean formulation series. This activator system, coupled with a highly stable and clean rinsing binder, provides the excellent activity, working life and cleaning needed for today’s demanding applications.This specification covers the Water-Soluble Contact paste; 89.5% for stencil printing and 87% for dispensing in interconnection of surface mount devices.

The Contact series of pastes, utilizing the polymer-dendrimer activator system, offer an extremely wide process window (basically a drop-in series), are extremely wettable, produce very shiny joints, have extended tack times before or after placing of components, and produce a polymer coating to the solder joints after reflow. These pastes are very competitively priced.

Our solder pastes have consistent properties for excellent process control, low levels of oxides to ensure excellent wetting and flow and are specifically designed for today’s tight packaging.

Download the MSDS and Technical Data Sheets for profiles, alloys and other specifications.

Hirsch Metals Pastes

Hirsch Metals also carries a complete line of Hirsch Metals pastes including Synthetic, Synthetic-LF Lead-Free, NC-559, N-560 and LF-4300. All Hirsch Metals solder pastes conform to ANSI/J-STD-006 and are available for immediate delivery in jars, cartridges, syringes and ProFlow Cassettes.

NoClean Solder PastesDownloadDownload
Hirsch synthetic lead free seriesThis series of solder paste is a synthetic poly-adduct designed to exceed requirements for reliable solder joints in SMT PC board assemblies. This paste was formulated to replace traditional rosin/resin based no-clean formulations with more reliable synthetic materials. The residue is pin probable for ICT inspection. The Synthetic series does not require refrigeration if left at room temperature for 6 months and has a 12- month refrigerated shelf life.
NC-559The NC-559 series is designed to meet requirements for reliable solder joints in SMT PC board assemblies. This formula was designed to have a wider process window and better compatibility with OSP surfaces. This formulation exhibits long print life in continuous printing operations. Residue can be removed using traditional solvents or Kyzen's Aquanox® with semi-aqueous systems.
NC-559-ASThe 559-AS solder paste was formulated with an extended tack and stencil life. The residue of 559-AS is pin probable for ICT inspection. This formula is designed to be very robust with a wider profiling window.
NC-559-ASMThe NC-559-ASM is a modified version of the NC-559-AS that contains a U.V. tracer for easier flux splatter inspection. This modified version is completely odorless. This product is designed for manual or semi- automatic stencil printing, where the operator is exposed to the smell of the product.
NC-560-LFNC-560-LF is a lead-free, no-clean, halide-free solder paste that delivers improved solderability with all Pb-Free metallization, including ENIG (Gold), OSP, HASL and immersion silver boards. NC-560-LF is RoHS-compliant and increases production yields with its unparalleled lot-to-lot and stencil printing consistency, and offers superior print performance characteristics, including excellent wetting, strong activity, ideal viscosity, long stencil life, thermal stability up to 300°C, and minimal residue. NC-560-LF is also low beading, low voiding, and anti-tombstoning to reduce scrap and rework.
Hirsch synthetic lead free seriesThis has been formulated to work with all lead-free formulations, including lead-free tin/silver/copper alloys without compromising SIR values. It is compatible with many lead-free board finishes and delivers excellent wetting with a light colored residue. Residues can be removed using traditional solvents or Kyzen's Aquanox with semi-aqueous systems. Kyzen's Aquanox saponifiers can be used to remove flux residues.
LF-4300A revolutionary new lead-free solder paste, LF-4300 offers true multi-process capabilities, a no-clean formula that is also water washable without saponification. Highly versatile and forgiving, LF-4300 uses synthetic materials for unparalleled lot-to-lot consistency and ideal printing characteristics (no mid-chip beading, low voiding and anti-tombstoning). LF-4300 is also compatible with high temperature alloys. It’s also VOC and halide-free, and features 12-hour stencil life and 24-hour abandonment time.
4300A revolutionary new solder paste designed for tin-lead alloys. 4300 offers true multi- process capabilities, a no-clean formula that is also water washable without saponification. Highly versatile and forgiving, 4300 uses synthetic materials for unparalleled lot-to-lot consistency and ideal printing characteristics (no mid-chip beading, low voiding and anti-tombstoning). This solder paste is VOC and halide-free, and features 12-hour stencil life and 24-hour abandonment time.
NoWater Soluble Solder Pastes DownloadDownload
WS-486The WS-486 is a non-resin formula that was developed to replace earlier water-soluble creams, containing no insoluble components. Excellent printability and stencil life is obtained for the most demanding applications, including hard to solder metallization, and harsh operatingenvironments.
NWS-4100 The Hirsch Metals NWS-4100 series is a new class of water washable formulations. Scientists at Hirsch Metals have developed a water-soluble version of the innovative polymer-dendrimer activator system. This activator system, coupled with a highly stable, clean rinsing binder, provides the excellent activity, working life, and cleaning needed for today's demanding applications. Excellent in reducing voiding with BGA packages. Residues can be removed with de-ionized or soft tap water at 130-150°F.
NWS-4200 The Hirsch Metals NWS-4200 series is a water washable formulation. This formulation uses the innovative polymer-dendrimer activator system. This activator system, coupled with a highly stable, clean rinsing binder, provides an increased activity. Excellent in reducing voiding with BGA packages. Residues can be removed with de- ionized or soft tap water at 130-150° F.
NWS-4200-4The Hirsch Metals NWS-4200-4 series is a new class of water washable formulations designed for difficult/oxidized pads and parts as well as OSP surfaces. This activator system, coupled with a highly stable, clean rinsing binder, provides excellent activity and working life. This formulation is not designed for BGA packages.
NWS-4200-6The Hirsch Metals NWS-4200-6 series is a new class of water washable formulations designed for difficult/oxidized pads and parts as well as OSP surfaces. This activator system, coupled with a highly stable, clean rinsing binder, provides excellent activity and working life. This formulation is not designed for BGA packages. Also designed for the use of lead-free parts on a tin-lead process.
NWS-4200-4P3The Hirsch Metals NWS-4200-4P3 series is a water washable formulation designed for difficult/oxidized pads and parts as well as OSP surfaces. Hirsch Metals developed this water-soluble version to be used in a very dry environment. This product will maintain its tack time and stencil life as it is coupled with a highly stable, clean rinsing binder that provides excellent activity. This product is not recommended for BGA packages.
NWS-4200-LFThe Hirsch Metals NWS-4200-LF is a water washable formulation that is formulated and designed to meet the reflow temperatures for lead-free alloys. The NWS-4200-LF exhibits exceptional print, long stencil life, and a wide reflow window. This Pb-free solder paste can maintain excellent cleanability even at elevated reflow temperatures.
NWS-4400-HAHirsch Metals NWS-4400-HA solder paste was designed for hard-to-solder surfaces with a higher activity. The NWS-4400-HA is classified as REL0 and is available in both leaded and non-leaded alloys. Residues can be removed with de-ionized or soft tap water at 130-150° F.
LF-4300 A revolutionary new lead-free solder paste, LF-4300 offers true multi-process capabilities, a no-clean formula that is also water washable without saponification. Highly versatile and forgiving, LF-4300 uses synthetic materials for unparalleled lot-to-lot consistency and ideal printing characteristics (no mid-chip beading, low voiding and anti-tombstoning). LF-4300 is compatible with high temperature alloys. It’s also VOC and halide-free, and features 12-hour stencil life and 24-hour abandonment time.
4300A revolutionary new solder paste designed for tin-lead alloys. 4300 offers true multi- process capabilities, a no-clean formula that is also water washable without saponification. Highly versatile and forgiving, 4300 uses synthetic materials for unparalleled lot-to-lot consistency and ideal printing characteristics (no mid-chip beading, low voiding and anti-tombstoning). This solder paste is VOC and halide-free, and features 12-hour stencil life and 24-hour abandonment time.
NoRMA Solder PastesDownloadDownload
RMA-223The RMA-223 solder paste is a homogeneous mixture of the highest quality pre-alloyed solder powders and mildly activated resin paste flux. With a special blend of gelling additives in this formulation, it prevents segregation of solder cream and provides a creamy mixture ready for application. The residue from RMA-223 is light amber and clear of solder balls. RMA-223 is a cream conforming to ANSI/J-STD-004-006.
RMA-223-ASRMA-223-AS is specially designed for today's SMT applications. It is a homogeneous mixture of the highest quality pre-alloyed solder powders and mildly activated resin paste flux. The RMA-223-AS has an increased activity over the RMA-223. The residue from RMA-223-AS can be removed using traditional solvents or Kyzen's Aquanox® with semi-aqueous systems. The residue from the RMA-223-AS is light amber in color.
RMA-223-LF RMA-223-LF is a solder paste designed to meet the requirements of lead-free. It delivers excellent wetting and spread with Sn96.5/Ag3.5 alloy. It was designed for this alloy only. The 223-LF residue is light amber in color and is non-corrosive. The residue can be removed with solvent or Kyzen’s Aquanox with semi-aqueous systems.
RMA-259-HT The RMA-259-HT is designed with a higher activity than the RMA-223-AS. This product is designed for high temperature alloys, such as Sn10/Pb88/Ag2. This formula is classified as an RMA and the residues can be left on the board or removed using traditional solvents or Kyzen's Aquanox® with semi-aqueous systems.