Hirsch Metals Corporation supplies a wide variety of solder pastes for electronics SMT applications.
Hirsch Metals RMA-223AS is a cream conforming to ANSI/J-STD-004-006. It is specifically designed for today’s SMT applications. It is a homogeneous mixture of the highest quality pre-alloyed solder powders and mildly activated resin paste flux. With a special blend of gelling additives in this formulation, it prevents segregation of solder cream and provides a creamy mixture ready for application. The residue from RMA-223AS is light amber and clear of solder balls. This specification covers the solder paste RMA-223-AS; 89.5-90.5% for stencil printing and 87% for dispensing in interconnection of surface mount devices.
“No Clean” Contact Paste
The “No Clean” series of solder pastes replaces RMA and Water Soluble types and eliminates any form of post soldering cleaning. This paste has a wider process window and better compatibility with OSPs than previous versions. It also provides long print life in continuous printing operations.With a highly successful and innovative polymer-dendrimer activator system
“Water Soluble" Contact Paste
The Hirsch Metals Water Soluble Contact Paste series is a new class of water washable formulations. Scientists at Hirsch Metals have developed a water-soluble version of the innovative polymer-dendrimer activator system used in the highly successful “No Clean” formulation series. This activator system, coupled with a highly stable and clean rinsing binder, provides the excellent activity, working life, and cleaning needed for today’s demanding applications.This specification covers the “Water Soluble” Contact paste; 89.5% for stencil printing and 87% for dispensing in interconnection of surface mount devices.
The Contact series of pastes utilizing the polymer-dendrimer activator system offer an extremely wide process window (basically a drop-in series), are extremely wettable, produce very shiny joints, have extended tack times before or after placing of components and produce a polymer coating to the solder joints after reflow. Very competitively priced.
Our solder pastes have consistent properties for excellent process control. Low levels of oxides assure excellent wetting and flow. Specifically designed for today’s tight packaging.
Call us for details of other types of paste or for special needs.