“No Clean" Fluxes
Type No. | Solids Content | SG at 25C | Acid Value | Properties |
---|---|---|---|---|
HM1313/5 | 5% | 0.801 | 23.5 | All 1313 fluxes leave minimal residues after soldering with excellent surface resistivity. Residues do not affect electrical testing. |
HM1313/8 | 8% | 0.814 | 34.0 | All 1313 fluxes produce excellent wetting for PTH, SMT, and mixed technology boards. Suitable for all the commonly used surface finishes. |
HM1313/10 | 10% | 0.818 | 46.0 | All 1313 fluxes are totally halide-free and pass the copper mirror test per Mil-F-14256. They can be applied by foam or spray fluxing. |
HM1313/17 | 4% | 0.793 | 17.0 | HM1717 contains a small amount of resin to enhance wetting and reduce the formation of solder balls. It can be applied with foam or spray fluxing. |
HM2121 | 2.5% | 0.806 | 22.0 | HM 2121 produces minimal residues, it meets all the cleanliness specs and conformal coating can be applied without post solder cleaning. | HM 2121 produces minimal residues, it meets all the cleanliness specs and conformal coating can be applied without post solder cleaning. |
HM2525 | 2.0% | 1.01 | 20.0 | A VOC free flux, water based. Pre-heat between 93/115C (200 -240F).
All water must be evaporated before soldering, to prevent solder balls. This flux is Halide-free and passes IPC/Bellcore and copper mirror tests. This flux does not require frequent density monitoring, thin with D.I. water. |
All the above fluxes have similar characteristics, all will produce assemblies with minimal residues. The lower the solids content the fewer visible residues will remain on the assembly after soldering. It may be necessary to experiment to arrive at the optimum flux type for a particular process.
Thinners (supplied in 5 and 55 gallon containers)
Type HM1000 thinner is specified for the HM1313 series of fluxes. Type HM2000 thinner is specified for the HM 1717 and MH2121 fluxes.
Note – Materials are added to the basic thinners to maintain the correct flux formulation
Type No. | Solids Content | Density | Properties |
---|---|---|---|
HM3535 | 18% | 0.956
@ 60F 0.952 @ 77F |
For wave soldering, in foam or spray fluxers
An organic acid flux with broad pre heat temp: range A high activity flux, excellent wetting with wave soldering Residues cleaned completely with hot water (min 120°F) Leaves a bright shiny fillet even on oxidized surfaces Low smoking, low fuming, stable flux with easy cleaning |
This flux flash point is 62F. Must be stored in a dry ventilated place away from flames, sparks, or heat. |
Thinner (supplied in 5 and 55 gallon containers)
The HM3000 thinner is specified for the HM3535 flux.
Note: Materials are added to the basic thinners to maintain the correct flux formulation.
Type No. | Description and Properties |
---|---|
HM3535 |
A highly active inorganic salt flux developed for use on difficult to solder metals such as stainless steel. It has excellent wetting action and thermal stability. Residues can be rinsed off in warm water. Scrubbing may be necessary or a 1% hydrochloric acid wash followed by a water rinse. Density 1.310 Solids 36% No flash point |
This flux is highly acidic it must be handled with great care Always use chemically inert gloves and safety glasses Assemblies must be adequately cleaned after soldering |
Material safety data sheets available upon request.