• Certified
  • ISO 9001-2015
  • Purity
  • Virgin Grade A Tin

Fluxes

Fluxes

“No Clean" Fluxes

Type No. Solids Content SG at 25C Acid Value Properties
HM1313/5 5% 0.801 23.5 All 1313 fluxes leave minimal residues after soldering with excellent surface resistivity. Residues do not affect electrical testing.
HM1313/8 8% 0.814 34.0 All 1313 fluxes produce excellent wetting for PTH, SMT, and mixed technology boards. Suitable for all the commonly used surface finishes.
HM1313/10 10% 0.818 46.0 All 1313 fluxes are totally halide-free and pass the copper mirror test per Mil-F-14256. They can be applied by foam or spray fluxing.
HM1313/17 4% 0.793 17.0 HM1717 contains a small amount of resin to enhance wetting and reduce the formation of solder balls. It can be applied with foam or spray fluxing.
HM2121 2.5% 0.806 22.0 HM 2121 produces minimal residues, it meets all the cleanliness specs and conformal coating can be applied without post solder cleaning.
HM 2121 produces minimal residues, it meets all the cleanliness specs and conformal coating can be applied without post solder cleaning.
HM2525 2.0% 1.01 20.0 A VOC free flux, water based. Pre-heat between 93/115C (200 -240F). All water must be evaporated before soldering, to prevent solder balls.
This flux is Halide-free and passes IPC/Bellcore and copper mirror tests.
This flux does not require frequent density monitoring, thin with D.I. water.

All the above fluxes have similar characteristics, all will produce assemblies with minimal residues. The lower the solids content the fewer visible residues will remain on the assembly after soldering. It may be necessary to experiment to arrive at the optimum flux type for a particular process.

Thinners (supplied in 5 and 55 gallon containers)
Type HM1000 thinner is specified for the HM1313 series of fluxes. Type HM2000 thinner is specified for the HM 1717 and MH2121 fluxes.
Note – Materials are added to the basic thinners to maintain the correct flux formulation

Water Soluble (OA) Organic Acid Fluxes

Type No. Solids Content Density Properties
HM3535 18% 0.956 @ 60F

0.952 @ 77F		 For wave soldering, in foam or spray fluxers

An organic acid flux with broad pre heat temp: range
A high activity flux, excellent wetting with wave soldering
Residues cleaned completely with hot water (min 120°F)
Leaves a bright shiny fillet even on oxidized surfaces
Low smoking, low fuming, stable flux with easy cleaning
This flux flash point is 62F. Must be stored in a dry ventilated place away from flames, sparks, or heat.

Thinner (supplied in 5 and 55 gallon containers)
The HM3000 thinner is specified for the HM3535 flux.

Note: Materials are added to the basic thinners to maintain the correct flux formulation.

  • • Water soluble fluxes are aggressive and solve many soldering problems
  • • The process must allow the assembly to be cleaned immediately after soldering
  • • Do not wave solder stranded/braided wires, the flux will wick up and cause corrosion
  • • Components must be spaced from the PWB to allow the water to flush away flux residues
  • • When using water soluble flux, the design of the assembly must allow for adequate cleaning
  • • A mild saponifier added to the initial wash will assist in cleaning tightly packaged assemblies
  • • Add fresh flux to maintain a constant flux level
  • • Replace the flux after every 40hours of operation when using a foam fluxer
  • • Maintain the flux density by the addition of Hirsch Metals thinner type HM3535

Inorganic Acid (Non-Electronic) Fluxe

Type No. Description and Properties
HM3535 A highly active inorganic salt flux developed for use on difficult to solder metals such as stainless steel. It has excellent wetting action and thermal stability.
Residues can be rinsed off in warm water. Scrubbing may be necessary or a 1% hydrochloric acid wash followed by a water rinse.

Density 1.310
Solids 36%
No flash point
NOT FOR USE WITH ELECTRIC OR ELECTRONIC EQUIPMENT

This flux is highly acidic it must be handled with great care
Always use chemically inert gloves and safety glasses
Assemblies must be adequately cleaned after soldering
Download the specification sheets

Material safety data sheets available upon request.